It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.
- Excellent capacity of solder-stickiness.
- Excellent Anti-wet Capacity.
- Widely used on BGA, PGA, CSP packages and flip chip operation.
- Suitable for multiple PCB reflow.
- No-clean and Lead free for environmental protection.