-15%

BST PPD 138 + BST PPD 183

Availability:

Out of stock


It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.

Feature :

  • Excellent capacity of solder-stickiness.
  • Excellent Anti-wet Capacity.
  • Widely used on BGA, PGA, CSP packages and flip chip operation.
  • Suitable for multiple PCB reflow.
  • No-clean and Lead free for environmental protection.

300.00 355.00

Out of stock

It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.

Feature :

  • Excellent capacity of solder-stickiness.
  • Excellent Anti-wet Capacity.
  • Widely used on BGA, PGA, CSP packages and flip chip operation.
  • Suitable for multiple PCB reflow.
  • No-clean and Lead free for environmental protection.
Category:
Weight 0.2 kg

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