It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.
Feature :
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Excellent capacity of solder-stickiness.
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Excellent Anti-wet Capacity.
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Widely used on BGA, PGA, CSP packages and flip chip operation.
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Suitable for multiple PCB reflow.
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No-clean and Lead free for environmental protection.
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