Description:
BGA IC Adhesive removing liquid softens and removes resinating and sealing glue of chip BGA IC of mobile phones.
The ingredients of it is environmental protection and safest. It has good permeability;
it can quickly soften and loosens solidified resin adhesive such as phenolics, epoxy, acrylate, polyurethane, organosilicon.
It does not to harm to circuit board and component, even to maintenance worker.
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