For Samsung J710F J610F Small Power IC Chip MU005X02 S2MU005X02 Original
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Weight | 0.02 kg |
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For Samsung J710F J610F Small Power IC Chip MU005X02 S2MU005X02 Original
Weight | 0.02 kg |
---|
Perfectly combined produce of BGA & CNC. CNC tech applied in BGA repair industry, make mobile repairing become more easier for CNC field users, can get more broad apply area
This item is perfect to grind and remove the CUP, HHD, WIFI, FONT chips in iPhone series mobile phone without any damage in the board. It is effective machine to help you repair the iPhone 6/6P/6S/6SP/7/7P/8/8P/X and ipad……. You can use the soldering station to solder a good chip in the board after grinding. Great grinding machine in mobile phone repairing and refurbishing
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