1. Replacing the S2MPS11B2 power IC chip.
2. Replace your broken or unworkable item with a new one.
3. Each item has been checked and in good condition before dispatch.
4. Professional installation is recommended. We will not be responsible for any damage to your cell phone / cell phone that you may cause during the replacement of replacement parts
| Weight | 0.02 kg |
|---|
Perfectly combined produce of BGA & CNC. CNC tech applied in BGA repair industry, make mobile repairing become more easier for CNC field users, can get more broad apply area
This item is perfect to grind and remove the CUP, HHD, WIFI, FONT chips in iPhone series mobile phone without any damage in the board. It is effective machine to help you repair the iPhone 6/6P/6S/6SP/7/7P/8/8P/X and ipad……. You can use the soldering station to solder a good chip in the board after grinding. Great grinding machine in mobile phone repairing and refurbishing
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