SUMSUNG S2MPU06 IC

Perfectly combined produce of BGA & CNC. CNC tech applied in BGA repair industry, make mobile repairing become more easier for CNC field users, can get more broad apply area

This item is perfect to grind and remove the CUP, HHD, WIFI, FONT chips in iPhone series mobile phone without any damage in the board. It is effective machine to help you repair the iPhone  6/6P/6S/6SP/7/7P/8/8P/X and ipad……. You can use the soldering station to solder a good chip in the board after grinding. Great grinding machine in mobile phone repairing and refurbishing