Perfectly combined produce of BGA & CNC. CNC tech applied in BGA repair industry, make mobile repairing become more easier for CNC field users, can get more broad apply area
This item is perfect to grind and remove the CUP, HHD, WIFI, FONT chips in iPhone series mobile phone without any damage in the board. It is effective machine to help you repair the iPhone 6/6P/6S/6SP/7/7P/8/8P/X and ipad……. You can use the soldering station to solder a good chip in the board after grinding. Great grinding machine in mobile phone repairing and refurbishing
Technical Parameters
Machine Dimensions: 580X560X750mm
Mould size: 150X135 mm
Engraving area: 200X100X100 mm
Rail type: Linear guide
Type of screw: Ball screw 1605, Pitch 4mm
Spindle motor: 800W water cooling spindle , 0-24000r/min
Collet type: ER11,1/8″(3.175mm) Collet
Repeat positioning Accuracy: 0.01mm
Communication interface: Not need computer/ SD Card / HD camera.
Software Compatability: Firmware v1.o
Machine weight: 78kg
Package size: 600*600*800mm
The machine already assembled & tested well, can directly use after take them out from package !
Product advantage:
a. Easy for learn and use
b. Intelligent system
c. Automatic detection
d. Visual design
e. high precision
f. SD card storage
Packing list:
Mould x 9 pcs for IP( 6/6P/6S/6SP/7/7P/8/8P/X, Size:150*135mm) with relative files
Power cord x 1
Ground wire x 1
Drill tips x 1 box(50pcs)
Allen wrench x 1
Spindle wrech x 2
Dust blower x 1
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Albertooriep –
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Albertooriep –
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battery –