Weight | 0.120 kg |
---|
Based on 0 reviews
0.0 overall
0
0
0
0
0
Be the first to review “PP PPD 183°C BGA SOLDER PASTE” Cancel reply
Related products
-
Flux & PPD Paste
BST PREMIUM FLUX 223
0 out of 5(0)Product Description: Brand Name: BST Model Number: RMA-223 Usage: Phone repair, Electronics welding, soldering. Description The Solder Paste is a high viscosity no-clean flux, it can be used for PCB, SMD, reworking, it can be used for soldering and reballing of computer and phone chips .
SKU: 0.020 -
Flux & PPD Paste
FONEKONG SOLDER PASTE 183°
0 out of 5(0)DESCRIPTION:Temperature: 183℃ FONEKONGIt can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.SKU: n/a
There are no reviews yet.