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FONEKONG SOLDER PASTE 183°

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Out of stock


DESCRIPTION:
Temperature: 183℃ FONEKONG
It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.

185.00 300.00

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DESCRIPTION:
Temperature: 183℃ FONEKONG
It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.
Feature :
  • Excellent capacity of solder-stickiness
  • Excellent Anti-wet Capacity
  • Widely used on BGA, PGA, CSP packages and flip chip operation
  • Suitable for multiple PCB reflow
  • No-clean and Lead free for environmental protection
Weight 0.05 kg

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